We are seeking a Thermo-Mechanical Modeling Engineer with a focus on modeling and designing high performance thermal test vehicle TTV in HVM for various customer shows the achievement of Corintis over the last year. Supported by investment companies with 24M$ capital enables Corinits to continue the successful way and become the world class liquid colling provider for high power chips in data centers Strengthen our thermo-mechanical team with your experience Setting up models of whole modules with packages on PCB and adapted cooling solution to analyse the thermo-mechanical stresses and propose measurements of improvements. Your main working projects are within Corintis Therminator & Thermal Test Vehicle (TTV) , but also cold plates and in chip cooling designs. Your simulation results are the basis of design decisions and product structures. Your simulation expertise supports also our reliability experts to predict and set the right life time estimations of our products.

Responsibilities:

• Setup of thermo-mechanical models for packages (from simple FlipChip up to advanced multi die package with interposer).
• Characterize the stresses and strains within the package and its PCB interface during the assembly process and application mode with cold plates or special cooling solution.
• Determine warpage values and calculate expected lifetime of interfaces based on the thermo-mechanical stresses and strains.
• Develop experimental verification, validation and correlation strategies for the simulation predicted results.
• Work closely with the reliability experts to develop a good model to hardware correlation.
• Present the modelling results to the product development team and highlight risks and improvement opportunities.
• Support the product development team during the design phase with the expertise.
• Collaborate with internal and external partners for modelling set up, result comparisons and material parameter.

Requirements:

• Education: M.Sc. in Mechanical Engineering, Microengineering, Materials Science, or a related field; a PhD is a plus.
• Experience: Minimum of 5 years relevant industrial experience in thermo-mechanical modelling of electronic systems, multilayer PCBs and complex modules.
• Expertise in Abaqus, Simscale and similar thermo-mechanical modelling tools would be a strong plus.

This is a great fit if you:

• Knowledge of solid mechanics, heat transfer, failure modes and thermo-mechanical interactions of materials.
• Hands-on experience by designing and building different sets of measurements for characterization and validation of packaging designs.
• Previous experience with finite element simulation tools for semiconductor packaging.
• Expertise in Abaqus, Simscale and similar thermo-mechanical modelling tools would be a strong plus.
• Experience in designing, organizing, and managing experiments and related activities.
• Proficiency in Data analytics.
• Demonstrated ability to write clear technical documentation of high quality.
• Communicating effectively, excellent relational skills, and able to work in a team with different professional and cultural backgrounds.
• Autonomous and proactive working style with excellent working organization and ethics.

• Self-motivated and well-organized, with a high standard of work ethics.
• Excellent communication and interpersonal skills, able to collaborate with diverse teams.
• Strong problem-solving abilities and creative thinking, proactive in developing innovative solutions and proposing alternative ideas
• Fluent in English.

This won’t be the right role for you if:

• If you only can work according to a fixed released process without deviations.
• If you don't want to dig to the ground on the modeling to understand deviations from reality.
• If you want to work alone on relaxed tasks and if good is good enough for you.
• If you prefer to work mainly from home.